Controlled air circulation ensures that hot air continually flows around the component and thus heats it equally from all sides. The MINI-OVEN 04 is also available with a nitrogen connection. Particularly for lead-free components, an inert nitrogen atmosphere is advantageous for reballing or pre-bumping, as wetting is improved and solder oxidization is reduced to a minimum. A menu driven, display-based operation makes the MINI-OVEN 04 very easy to use and offers the option of retrospectively editing the stored programs (up to 99). Advanced control algorithms enable experienced users to precisely optimize heating profiles.Together with the improved sensor location, the component temperature can be determined at any time. MARTINs MINI-OVEN 04 is ideal for the complete QFN solder bumping process, even for the smallest pitches.
The item "MARTIN mini-oven 04 Reballing BGA IC Oven Reflow GPU PS4 Soldering Balls" is in sale since Tuesday, June 12, 2018. This item is in the category "Business, Office & Industrial\Metalworking/Milling/Welding\Welding & Soldering\Soldering & Desoldering\Soldering Irons". The seller is "eqlondon" and is located in Mitcham, London. This item can be shipped to all countries in Europe, Australia, United States, Canada, Japan, New Zealand, China, Israel, Hong Kong, Indonesia, Malaysia, Mexico, Singapore, South Korea, Taiwan, Thailand, Bangladesh, Bermuda, Bolivia, Barbados, Brunei darussalam, Cayman islands, Egypt, Guadeloupe, French guiana, Jordan, Cambodia, Sri lanka, Macao, Maldives, Martinique, Nicaragua, Oman, Pakistan, Paraguay, Reunion, Saudi arabia, United arab emirates.